Silver Sintering Paste is a kind of high silver-filled die attach paste, which can achieve ultra-high thermal conductivity. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times. It can be applied to printing or dispensing processes, which can ensure higher thermal conductivity in lead frame and LED packaging applications.
Globally, the main manufacturers of Silver Sintering Paste include Heraeus，Kyocera and Indium，etc. Heraeus has the largest market share of over 30%. Asia-Pacific is the largest market, holds a share nearly 40%.
The global Silver Sintering Paste market was valued at US$ 60 million in 2020 and it is expected to reach US$ 83 million by the end of 2027, growing at a CAGR of 4.8% during 2021-2027.
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
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The Research Report Includes Specific Segments By Region (Country), By Manufacturers, By Type And By Application. Each Type Provides Information About The Production During The Forecast Period Of 2016 To 2027. By Application Segment Also Provides Consumption During The Forecast Period Of 2016 To 2027. Understanding The Segments Helps In Identifying The Importance Of Different Factors That Aid The Market Growth.
Segment by Type
- Pressure Sintering Paste
- Pressure-less Sintering Paste
Segment by Application
- Power Semiconductor Device
- RF Power Device
- High Performance LED
- Alpha Assembly Solutions
- Advanced Joining Technology
Production by Region
- North America
Consumption by Region
- North America (United States, Canada)
- Europe (Germany, France, U.K., Italy, Russia)
- Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
- Latin America (Mexico, Brazil, Argentina)
- Middle East & Africa (Turkey, Saudi Arabia, UAE)
Mr. Shirish Gupta
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